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Hot Chips 2026: Nvidia presents Groq 3 LPX architecture and unveils its first third-party inference benchmark
Premium Igor Arsovski, now Nvidia's VP of hardware, presented the Groq 3 LPX rack's architecture and published the first third-party benchmark of the hardware.
Hot Chips 2026: d-Matrix stacks AI accelerator directly on custom DRAM for 100 TB/s per card
Premium Heading into production during the tightest DRAM market in more than a decade.
OpenAI’s 700W Jalapeño ASIC outpaces 1,400W Nvidia flagship GPU
OpenAI arrived at Hot Chips on Tuesday with benchmarks claiming its first in-house chip beats Nvidia's GB300.
Hot Chips 2026: Micron warns HBM wafer penalty is widening with every generation
Premium Micron Fellow Raghu Sreeramaneni told the Hot Chips 2026 conference that the silicon penalty HBM carries against DDR5 is growing with every generation.
Hot Chips 2026: SK hynix pushes hybrid bonding to HBM5 as AI memory hits 775-micron ceiling
Premium The problem, per SK, is that HBM cubes are capped at a total thickness of 775 microns, the standard thickness of a 300mm logic wafer.
Kyoto University builds transistor that survives 600C temperatures, compatible with standard fabs
A research team at Kyoto University has built a silicon carbide transistor that operates at 600°C (873 K) using ion implantation.
LG enters chip packaging arena with Laser Direct Imaging machine, as TSMC's CoWoS remains constrained
Premium LG rolls-out laser direct imaging lithography machine for chip packaging and high-density PCBs.
Nvidia denies report it will ship Groq-based LPUs to China by year-end
Nvidia has rejected a report published by The Information that it plans to begin small-batch shipments of an LPU tailored for Chinese customers by the end of 2026.
