Altera and TSMC to Jointly Develop 55 nm EmbFlash Process Technology
The initiative aims to create programmable devices that are tailored for “high-volume applications” in industry.
Altera has announced that it will once again be partnering with the Taiwan Semiconductor Manufacturing Company (TSMC) to develop 55 nm embedded flash (EmbFlash) technology. When compared to the previous generation, it will deliver faster computing, possess a tenfold increase in gate density, and shrink the flash and SRAM cell sizes by 70 and 80 percent, respectively.
The ultimate aim of this initiative is to permit developers of high-volume applications to build feature-rich, non-volatile systems for a range of markets including "automotive and industry."
"Our relationship with TSMC is built on a shared commitment to delivering the latest technologies and capabilities to customers,” said Reda Razouk, Vice President of Process Technology Development at Altera. "Adding 55nm EmbFlash to our product portfolio extends Altera’s tailored strategy in which Altera optimizes its device families based on process technology, architecture and application-specific IP to meet system requirements.”

Does this guy not realize that companies like Intel are manufacturing at the 12nm scale with trigate tech? Maybe its just me, but I cannot grasp how "delivering the latest technologies" equals 55nm tech.
This tech is on the same process scale as late run pentium 4's to pentium dual core and core duo CPU's(circa 2005-2006.)
Does this guy not realize that companies like Intel are manufacturing at the 12nm scale with trigate tech? Maybe its just me, but I cannot grasp how "delivering the latest technologies" equals 55nm tech.
This tech is on the same process scale as late run pentium 4's to pentium dual core and core duo CPU's(circa 2005-2006.)
Memory and processors use different kinds of circuits, as a result, different kinds of transistors are needed.
The semiconductor fabrication process can be the same for all semiconductors, whether you are manufacturing RAM, CPU's or Flash makes no difference. Additionally, memory is much easier to manufacture than processors which is why they currently use an 8nm scale process. I was talking about the nm scale of the fabrication and comparing it to a CPU, because thats more memorable than saying its on the same process scale as ddr-333 when first released.
m32, make blanket statement about nothing...
My point which both of you seem to have missed, is that while this may be a drastic improvement over the previous generation, they should have been able to retool an existing 32/28nm line much cheaper than building a new 55nm production line and had the benefit of 40-50% better power efficiency and decreased temperatures. At least 32nm and 28nm products are still being produced, whereas 55nm scale products really are from 2006.
Here have a good read and feel free to downvote me when you have no clue what your talking about.
http://en.wikipedia.org/wiki/Memory_module
http://en.wikipedia.org/wiki/Semiconductor_device_fabrication
http://en.wikipedia.org/wiki/Integrated_circuit