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ISSCC 2026: AMD discloses how the Instinct MI355X doubled per-CU throughput despite lower compute unit count
By Luke James published
Premium Taking to the stage at ISSCC, AMD’s Ramasamy Adaikkalavan talked through how AMD managed to fit nearly double the compute throughput into the same die area as its predecessor,

Rapidus secures $1.7 billion from Japan’s government and private investors for 2nm chip production
By Luke James published
Under the arrangement, the government will initially hold roughly 10% of Rapidus's voting shares and the majority of its stake in non-voting stock.

Imec's new post-exposure bake method speeds up EUV chipmaking tools, boosting production for the most advanced chips
By Anton Shilov published
Increased oxygen concentration during the EUV lithography post-exposure bake step can increase photoresist performance by 15% - 20%, according to Imec's findings.

Intel Foundry boss leaves for Qualcomm
By Anton Shilov published
Changing of the guard at Intel Foundry

Chipmakers still suffering from rare earth shortages, says report
By Jowi Morales published
Some suppliers have even rejected taking on new clients because of limited inventories.

China to increase leading-edge chip output by 5x in two years
By Anton Shilov published
Chinese foundries looking to increase 7nm and below capacity to 100,000 wafer starts per month in one or two years, says Nikkei.

US gov't warned Nvidia CEO Jensen Huang, Tim Cook, and Lisa Su that China could invade Taiwan by 2027
By Zak Killian published
A new report reveals that tech CEOs were cautioned in 2023, yet haven't really taken action on the info.

ASML makes breakthrough in EUV chipmaking tech, plans to increase speed by 50% by 2030
By Anton Shilov published
ASML to use a new CO2 laser system and tin droplet generator to increase EUV light source performance to 1000W and lithography tool productivity to 330 wafers per hour in 2030 and beyond.

The state of China's decade-long semiconductor push: still a decade behind, despite hundreds of billions spent and significant progress
By Anton Shilov published
Premium After 10 years and hundreds of billions of investments, China's semiconductor supply chain is still decades behind chip supply chain in America and Taiwan.

TSMC considers an additional $100 billion investment into Arizona fabs to bolster American chipmaking efforts
By Anton Shilov published
TSMC, other companies to invest $250 billion in the U.S. as part of trade deal, TSMC reportedly mulls additional $100 billion investment and four more fab modules.
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