Latest about Manufacturing
Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture
The announcement came two days after Huawei presented LogicFolding and its accompanying Tau Scaling Law at ISCAS 2026.
China adds homegrown AI chips to 'secure and reliable' procurement list for the first time
The certifications are valid for three years and were issued jointly by the China Information Technology Security Evaluation Centre and the National Secrecy Science and Technology Evaluation Centre.
SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source
Technology may solve HBM's critical heating problem
Imec builds world's first High-NA EUV-fabricated quantum dot qubit device
Premium Imec may have revealed quantum computing’s clearest path to industrial-scale manufacturing
Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density
Flagship Huawei Mate 90 series will be the first commercial processors to feature the LogicFolding architecture
Samsung's $400,000 payout for memory workers sparks revolt as other divisions get only $4,000, fueling intentional production slowdowns
It’s understood that meetings are being canceled across Samsung's non-memory and shared business units.
The custom AI ASIC state of play (May 2026) — Broadcom deals, Google TPUs, Meta MTIA & beyond
Premium ASIC-based AI server shipments are projected to reach 27.8% of the market in 2026, the highest share since 2023, and custom ASIC shipments will grow 44.6% year-over-year.
AMD begins production ramp of 256-core EPYC Venice
AMD has announced that its 6th Gen EPYC processor, codenamed Venice, has entered production ramp on TSMC's N2 process in Taiwan.
