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OpenAI’s 700W Jalapeño ASIC outpaces 1,400W Nvidia flagship GPU
OpenAI arrived at Hot Chips on Tuesday with benchmarks claiming its first in-house chip beats Nvidia's GB300.
Hot Chips 2026: Micron warns HBM wafer penalty is widening with every generation
Premium Micron Fellow Raghu Sreeramaneni told the Hot Chips 2026 conference that the silicon penalty HBM carries against DDR5 is growing with every generation.
Hot Chips 2026: SK hynix pushes hybrid bonding to HBM5 as AI memory hits 775-micron ceiling
Premium The problem, per SK, is that HBM cubes are capped at a total thickness of 775 microns, the standard thickness of a 300mm logic wafer.
Kyoto University builds transistor that survives 600C temperatures, compatible with standard fabs
A research team at Kyoto University has built a silicon carbide transistor that operates at 600°C (873 K) using ion implantation.
LG enters chip packaging arena with Laser Direct Imaging machine, as TSMC's CoWoS remains constrained
Premium LG rolls-out laser direct imaging lithography machine for chip packaging and high-density PCBs.
Nvidia denies report it will ship Groq-based LPUs to China by year-end
Nvidia has rejected a report published by The Information that it plans to begin small-batch shipments of an LPU tailored for Chinese customers by the end of 2026.
Synopsys validates a PCIe 6.0 PHY inside a face-to-face 3D stack at 64 GT/s
Synopsys has published silicon results for what it calls the first 3D PCIe 6.0 test chip, a 5nm PHY built into a face-to-face stacked package.
SMIC posts record $3B quarter and hikes wafer prices
Premium SMIC posted its first $3 billion quarter earlier this month, with revenue up 36.1% year on year, net profit nearly tripling to $479.2 million.
