Intel Delays $200 Billion Decision on New Fab Sites

Intel has delayed its decision for its new multi-billion chip manufacturing sites in Europe and the U.S. until 2022. The delay will have little impact on an industry that cannot meet the demand for its products now, but it emphasizes the complexity of these decisions.

Intel hoped to announce the next locations in the United States and Europe early next year, which Reuters quotes chief executive Pat Gelsinger as saying at a press conference dedicated to a new chip packaging facility in Malaysia.   

Intel admitted earlier this year that its brand-new small city-sized fab complex in the U.S. would cost $60 to $120 billion. The site will eventually host between six and eight fab modules that will make chips using its leading-edge nodes and package them using Intel's proprietary technologies like EMIB and Foveros. 

Intel's plans for European fabs look very similar. The company wants to establish a new site in mainland Europe, build a $20 billion fab there and then construct additional modules, increasing total investments to around $100 billion over time. 

The brand-new large manufacturing sites are important for Intel and its foundry business as they will enable the company to scale its production capacities in TSMC's manner — relatively quickly and predictably. Yet, the amount of negotiations, considerations, preparations, and arrangements for such fab complexes is incredible, which likely factors into why Intel delayed the decisions and announcements until 2022.

Anton Shilov
Contributing Writer

Anton Shilov is a contributing writer at Tom’s Hardware. Over the past couple of decades, he has covered everything from CPUs and GPUs to supercomputers and from modern process technologies and latest fab tools to high-tech industry trends.