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ASML's planned Low-NA EUV machine price hikes reportedly anger TSMC
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TSMC confirms significant yield and performance improvements in A14 update
TSMC's A14 process technology progresses faster than N2 at this stage of development as developers of both client and AI/HPC plan to use it.
ASML looks to increase prices of its Low-NA EUV tools beyond existing productivity-based model — company wants to capture the value of all the advantages its tools offer, not just wafer throughput improvements
ASML's comments point to intentions to increase prices, though the company is expected to maintain its value-based approach to price setting. Yet, TSMC is reportedly unhappy about the potential plan.
Tower Semiconductor revives shuttered Panasonic-era fab in $3 billion Japan photonics expansion — METI-backed plan targets $3.6 billion revenue by 2028
Premium Tower Semiconductor has announced a dual-track expansion of its 300mm silicon photonics, silicon germanium, and advanced packaging operations in Japan
Intel becomes the first company to ship high-volume logic chips made with ASML's High NA EUV
Intel is using ASML’s High-NA EUV tools to pattern select Panther Lake layers, marking the technology’s first use in high-volume logic production
Intel's EMIB packaging gains traction as chip designers look beyond TSMC's constrained CoWoS
Premium Google has reportedly chosen Intel's EMIB-T over TSMC's CoWoS-L for its next-generation TPU, codenamed Humufish. But will Google be alone in its alleged decision?
Researchers create programmable material that can steer heat and remember its state without power
Researchers created a programmable thermal material that steers heat and retains its state without power, a breakthrough that could benefit AI chips, silicon photonics, and infrared devices.
Micron commits $500 million to GlobalWafers' Texas wafer plant as it raises U.S. spending to $250 billion
Premium Running until 2035, the $250 billion spending target is attached to a goal of making 40% of Micron's DRAM in the U.S. by the mid-2030s.
