RAM News

Patriot brought a number of new SSD/memory products to Computex 2025, including a new 9600 MT/s-capable DDR5 CUDIMM memory module and the world's first DRAMless PCIe 5.0 SSD.

Silicon Power has unveiled two new DDR5 XPOWER memory modules, its first to feature CUDIMM technology.

Samsung plans to adopt hybrid bonding for HBM4 to improve thermal and interface performance, potentially gaining a competitive edge over SK hynix, which may delay its use due to costs concerns.

NEO Semiconductor has announced progress on its new 3D X-DRAM technology, with new 1T1C and 3T0C chip designs increasing DRAM speeds by an order of magnitude for tomorrow’s top-end computing.

Samsung is ending DDR4 production in favor of more lucrative technologies like DDR5 and HBM.

G.Skill has launched the first 256GB (64GBx4) UDIMM memory kit, hitting DDR5-6000 CL32 speeds out-of-the-box with EXPO.

HBM4 offers faster data rates, more channels, and higher memory capacities, with features like Directed Refresh and flexible voltage options to boost performance and reliability.

FMC and Neumonda develop non-volatile FeRAM products, revive memory production in Germany.

G.Skill is introducing high-speed 64GB modules to the market with its latest Trident Z5 Royal Neo 128GB (64GBx2) memory kit, which is advertised to reach DDR5-8000 speeds.

Chinese memory maker CXMT is reportedly preparing to raise DDR4 prices after months of aggressive discounting, as demand stabilizes and major suppliers shift focus to newer memory types.