RAM News
Latest RAM News

Chinese companies are stockpiling HBM2E chips ahead of new U.S. export rules
By Anton Shilov published
Baidu, Huawei, and Tencent are stockpiling Samsung's HBM2E memory to use with their own AI processors.

Samsung mass produces 'world's thinnest' LPDDR5X
By Anton Shilov published
Samsung's new LPDDR5X uses 12nm technology to free up space in mobile devices.

JEDEC's new standards will double DDR5 bandwidth, enable faster memory for laptops
By Jowi Morales published
JEDEC plans to introduce multiplexed memory to double the bandwidth of current DDR5 RDIMMs on servers and data centers. It's also working on adding LPDDR6 to CAMM2 for laptops.

Gigabyte has to twist its RAM slots to fit 48 DDR5 sticks into a standard server
By Sunny Grimm published
Gigabyte's R283-ZK0 motherboard fits two AMD SP5 server sockets on one board, and has to twist the onboard DDR5 memory slots to fit 48 DIMMs for 2 DIMM per channel operation.

Buckle up! Apacer launches seat belt for RAM sticks
By Dallin Grimm published
“Buckle up for safety” includes computer components

Chinese memory maker gets $2.4 billion to build HBM for AI processors — Shanghai packaging facility to open in 2026
By Anton Shilov published
CXMT to invest $2.4 billion to build advanced packaging fab to build HBM memory for AI.

Micron is the last memory maker to join the EUV party
By Anton Shilov published
Micron reiterates its plans to use EUV for high-volume DRAM production next year as it starts pilot production on a 1-gamma node.

Teamgroup's T-Force Dark AirFlow D5 memory cooler looks like a GPU cooler
By Roshan Ashraf Shaikh published
Cooling down while looking...cool?
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