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The First Hammer Board Hits the THG Lab

By Frank Völkel

published 17 October 2002

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Page 5 of 6:

Overview: VIA Roadmap 2003

Page 1: Waiting For AMD
Page 2: VIA's Offering For The AMD Hammer
Page 3: VIA VT8188A: Details On Thermal Protection
Page 4: In The Planning Stages: Dual-Channel DDR333 From VIA
Page 5: Overview: VIA Roadmap 2003
Page 6: Comparison: All Chipsets For The AMD Hammer

Overview: VIA Roadmap 2003

Excerpt from the latest VIA roadmap.

An overview of VIA Southbridges for the Hammer.

Compatibility of the various Northbridges.

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