PC Components Motherboards Chipsets The First Hammer Board Hits the THG Lab Features By Frank Völkel published 17 October 2002 Page 5 of 6: Overview: VIA Roadmap 2003 Page 1: Waiting For AMD Page 2: VIA's Offering For The AMD Hammer Page 3: VIA VT8188A: Details On Thermal Protection Page 4: In The Planning Stages: Dual-Channel DDR333 From VIA Page 5: Overview: VIA Roadmap 2003 Page 6: Comparison: All Chipsets For The AMD Hammer Copy link Facebook X Whatsapp Reddit Pinterest Flipboard Email Share this article 0 Join the conversation Follow us Add us as a preferred source on Google Newsletter Tom's Hardware Get the Tom's Hardware Newsletter Get Tom's Hardware's best news and in-depth reviews, straight to your inbox. Contact me with news and offers from other Future brands Receive email from us on behalf of our trusted partners or sponsors By submitting your information you agree to the Terms & Conditions and Privacy Policy and are aged 16 or over. You are now subscribed Your newsletter sign-up was successful An account already exists for this email address, please log in. Subscribe to our newsletter Overview: VIA Roadmap 2003Excerpt from the latest VIA roadmap.An overview of VIA Southbridges for the Hammer.Compatibility of the various Northbridges.Stay On the Cutting Edge: Get the Tom's Hardware NewsletterGet Tom's Hardware's best news and in-depth reviews, straight to your inbox.Contact me with news and offers from other Future brandsReceive email from us on behalf of our trusted partners or sponsors 1 2 3 4 5 6 Current page: Overview: VIA Roadmap 2003 Prev Page In The Planning Stages: Dual-Channel DDR333 From VIA Next Page Comparison: All Chipsets For The AMD Hammer TOPICS CeBIT athlon Intel Intel Core x86 Xeon AMD See all comments (0) Frank Völkel No comments yet Comment from the forums
