Latest about High NA EUV
TSMC, Samsung, and Intel shore up support with ASML to deploy larger High-NA EUV photomasks
Premium ASML, Intel, Samsung, and TSMC back development of 6×12-inch to build large processors using High-NA EUV lithography systems without stitching.
TSMC to start using High-NA EUV lithography in 2030
TSMC discloses plans to use High-NA EUV lithography in 2030, 6×12-inch photomasks with new scanners in 2033.
Intel surpasses one million High-NA EUV wafers processed, outpaces the rest of the industry combined
Intel is leading the semiconductor industry with High-NA fleet and process-maturity milestone as it reaches 1 million wafers processed using High-NA tools, moves forward with 6×12 photomask effort.
Samsung Foundry updates process roadmap to move 1.4nm to 2029
Samsung Foundry's plans change significantly from the 2024 roadmap.
ASML's planned Low-NA EUV machine price hikes reportedly anger TSMC
Premium Low-NA, high stakes
Intel becomes the first company to ship high-volume logic chips made with ASML's High NA EUV
Intel is using ASML’s High-NA EUV tools to pattern select Panther Lake layers, marking the technology’s first use in high-volume logic production
Intel expands production of photomasks in California: EUV and High-NA EUV in the focal point
Intel begins expansion of its Bowers Campus in Santa Clara to produce more photomasks in-house, which is set to be crucial as process technologies get more sophisticated.
ASML makes breakthrough in EUV chipmaking tech, plans to increase speed by 50% by 2030
ASML to use a new CO2 laser system and tin droplet generator to increase EUV light source performance to 1000W and lithography tool productivity to 330 wafers per hour in 2030 and beyond.
