Latest about High NA EUV
Intel and ASML achieve 'First Light' milestone with world's most advanced chipmaking tool
ASML and Intel achieve first light on wafer milestone with ASML's Twinscan EXE:5000 lithography system for the first time.
ASML explores Hyper-NA chipmaking tools as the next step in shrinking transistors
ASML mulls Hyper-NA lithography with a higher than 0.7 numerical aperture in 2030s.
Evidence mounts that TSMC won't adopt next-gen EUV chipmaking tools until 1nm debuts in the 2030 timeframe
Fab toolmaker tells DigiTimes that TSMC will likely adopt High-NA at 1nm.
ASML fires back at accusations that its next-gen High-NA EUV chipmaking tools are too expensive
ASML asserts that its next-generation High-NA EUV tools have numerous advantages over existing Low-NA tools.
TSMC won't adopt advanced High-NA EUV chipmaking tools until 2030 or later
According to China Renaissance, TSMC might adopt High-NA EUV lithography for a post-1nm process technology in 2030 or later.
ASML ships groundbreaking new chipmaking tool to Intel — High-NA lithography tool needed for next-gen process nodes could cost ~$400 million
ASML on Thursday announced that it had begun shipping the industry's first extreme ultraviolet (EUV) lithography tool with a 0.55 numerical aperture (High-NA) to Intel.
Intel is buying leading-edge lithography tools — report says Intel will acquire 6 of 10 High-NA EUV tools produced by ASML next year
Intel is gearing up to be high-NA EUV lithography champ with orders for six additional Twinscan EXE machines.
ASML to Ship First High-NA EUV Tool This Year: $300 Million per Scanner
ASML expects its partners to start using High-NA EUV scanners in 2025 and beyond.
