Apple, Microsoft, and other big tech companies formed the Semiconductors in America Coalition to lobby for U.S. chips.
Intel announced ten new Tiger Lake-H chips that come with eight cores fabbed on the 10nm SuperFin process.
IBM showed a 300mm wafer containing its 2nm process node that will be shared with both Samsung and Intel.
Multiple benchmarks show Intel's Core i5-11400 Rocket Lake chip beating AMD's Ryzen 5 5600G Zen 3 APU.
TSMC reportedly plans to build a total of six fabs—five more than anticipated—in Arizona over the next three years.
Arm co-founder Hermann Hauser said that Nvidia is "clearly showing it will compete unfairly" if it acquires the company.
Taiwan has reportedly told recruiting firms to remove listings for high-tech positions based in China.
European politicians mull different semiconductor industry strategies, will present updated view in early May.