AMD Says It Could Bring Chiplets to Thinner Ryzen Laptops

Ryzen Mobile Processor
(Image credit: AMD)

AMD has confirmed that it could potentially switch its Ryzen mobile CPUs from a monolithic design to a chipset-based design in the future, just like its Ryzen desktop and EPYC server CPUs, according to a report from QuasarZone,. The only caveat behind this strategy, however, is that AMD will need to find enough of a performance/feature improvement in a chiplet-base design first before it can make the switch.

AMD released these details in a recent Q&A session it held with the press in Korea. AMD shed light on its chipset-based approach to mobile CPUs in response to a question asking why its chipset-based architectures have not been introduced into the laptop market yet, particularly the ultra-thin/ultralight notebook market.

"When creating the product, we are considering both monolithic and chiplet structures. Both desktops and laptops," said AMD General Manager David McAfee, per a machine translation. "However, on the laptop side, it is difficult to introduce chiplets because of the major obstacle of power. Since there is a power penalty to be paid when introducing chiplets, it seems that chiplets can be introduced at a time when it is judged to be worth it.

So far, considering such factors, the results have shown that monolithic structures are more cost-effective and efficient in the laptop market than chiplets. If there is an incentive to risk it and move in the future, I think I would consider a chiplet."

Intel will be the first CPU manufacturer to take a chiplet-based philosophy to the laptop market in full force. Its upcoming Meteor Lake architecture plans to bring all of the advantages afforded by chiplet-based designs to the table without the power consumption penalties usually associated with chiplet architectures. 

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Aaron Klotz
Contributing Writer

Aaron Klotz is a contributing writer for Tom’s Hardware, covering news related to computer hardware such as CPUs, and graphics cards.

  • bit_user
    Leading up to the launch of RDNA3, AMD said it made huge breakthroughs in the efficiency of die-to-die communication. Perhaps that's the new enabler for using chiplets in laptop processors.
    Reply
  • JayNor
    I think AMD has to be selective about using advanced packaging while TSM is expanding their CoWoS capacity over the next year to service the ai chip demand.
    Reply
  • pug_s
    Right now, the AMD's Ryzen 3000, 5000 and 7000's chips has a considerable distance between the IO Die and the compute dies which cause this kind of power penality. Perhaps it is possible to do this by copying Apple m1 max/pro SOCs by putting 2 chips together.
    Reply