Intel moves closer to building Apple’s entry-level M-series chips on 18A from 2027 — insider claims chipmaking deal could be close at hand

Apple is preparing to qualify Intel’s 18A process for its lowest-end M-series processor, according to a post on X from analyst Ming-Chi Kuo. He reports that Apple has already signed an NDA with Intel and received the 18AP PDK 0.9.1GA, with internal simulation work tracking close enough to expectations for the company to wait on the full 1.0 and 1.1 releases currently planned for the first quarter of 2026.

On that trajectory, Intel could begin shipping production silicon in the second or third quarter of 2027. This would mark the first time Intel had fabbed any Apple silicon since Apple dumped the company entirely in late 2023.

The chip in question is the base M-class SoC used in the MacBook Air and iPad Pro, which together accounted for around 20 million units in 2025. Kuo expects annual shipments of this tier to settle between 15 million and 20 million units in 2026 and 2027 as Apple introduces a lower-cost MacBook line built around an iPhone-class processor. These volumes are significant for any new foundry customer, yet small enough that they would not shift TSMC’s near-term revenue mix or its lead in advanced manufacturing.

Kuo’s post also describes a marked improvement in visibility around Intel becoming a viable advanced-node supplier to Apple. Until recently, 18A’s future as a general-purpose foundry platform looked uncertain. Intel has spent the past two years tightening roadmaps and warning investors that early 18A margins would be weak while yields climbed to production targets. The arrival of an Apple design team working directly with pre-release PDKs indicates that the node has reached a stage where external customers can begin serious evaluation.

Apple’s own motivations are twofold. The company remains anchored to TSMC for its most advanced products, from iPhones to the higher-end M-series parts, but has been pursuing greater supply chain redundancy since the 2020-2022 disruption cycles. Placing its least complex Mac-class SoC on a second source reduces single-foundry exposure without touching the flagship lines that rely on TSMC’s flagship silicon.

Kuo also notes that the move would align with Washington’s push for more domestic semiconductor manufacturing. Intel’s Arizona fabs are central to that policy and would be natural candidates to host 18A for an Apple order.

The risk, as always, lies in timelines. Apple’s internal work may be on track, yet nothing proceeds to tape-out until the full PDK is in hand and Intel demonstrates repeatable performance and yield metrics. Between now and the first half of 2026, Intel must deliver the complete tool chain and process corner validation that Apple’s silicon teams require. If it does, 2027 becomes the first realistic opportunity for a mainstream Apple product to ship on Intel’s most advanced process. If it slips, the plan shifts with it.

For now, if accurate, Apple’s decision to move beyond preliminary talks and into structured 18A evaluation gives Intel something it has lacked for several years: a prospective anchor customer willing to test the maturity of its leading-edge manufacturing at scale.

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