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PremiumHere’s what the FCC ban on foreign-manufactured routers actually means for consumers
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PremiumAmerica’s AI chip rules keep changing — and the rest of the world is paying the price
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PremiumAnalyzing Elon Musk's TeraFab — A step towards Tesla and SpaceX's partial vertical integration, or an unattainable dream?
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PremiumTesting DirectStorage with GPU decompression — do Blackwell GPUs have the upper hand?
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Access Bench to view a treasure trove of data and compare products
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Premium Features
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PremiumAmerica’s AI chip rules keep changing — and the rest of the world is paying the price
By Chris Stokel-Walker Published -
PremiumHere’s what the FCC ban on foreign-manufactured routers actually means for consumers
By Brandon Hill Published -
PremiumAnalyzing Noctua's roadmap — new PSUs, fan-equipped mice, the elusive Thermosiphon, and disappearing prototypes
By Niels Broekhuijsen Published -
PremiumTesting DirectStorage with GPU decompression — do Blackwell GPUs have the upper hand?
By Dan Mateescu Published -
PremiumGTC 2026: Ian Buck press Q&A transcript — VP of Hyperscale and HPC speaks out on shelving CPX and shipping LPU decode this year
By Luke James Published -
PremiumThe $599 MacBook Neo stunned the budget laptop market
By Andrew E. Freedman Published
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Roadmaps
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PremiumAnalyzing Noctua's roadmap — new PSUs, fan-equipped mice, the elusive Thermosiphon, and disappearing prototypes
By Niels Broekhuijsen Published -
PremiumAMD's Enterprise CPU and GPU roadmap: Venice, Verano, Zen 6, Helios, and CDNA
By Anton Shilov Published -
PremiumIntel's roadmaps examined — 14A, Nova Lake, Diamond Rapids & AI accelerator push
By Luke James Published -
PremiumUALink roadmap plots course to optimized AI data center interconnects
By Anton Shilov Published -
PremiumThe future of Quantum computing — the tech, companies, and roadmaps that map out a coherent quantum future
By Francisco Pires Published -
PremiumHuawei Ascend NPU roadmap examined — company targets 4 ZettaFLOPS FP4 performance by 2028, amid manufacturing constraints
By Anton Shilov Published -
PremiumInside the AI accelerator arms race: AMD, Nvidia, and hyperscalers commit to annual releases through the decade
By Anton Shilov Published -
PremiumThe future of DRAM: From DDR5 advancements to future ICs
By Anton Shilov Published -
PremiumDesktop GPU roadmap: Nvidia Rubin, AMD UDNA & Intel Xe3 Celestial
By Hassam Nasir Published -
News AnalysisSilicon Motion announces new devices: PCIe 6.0 SSDs, 256 / 512 TB drives, and next-gen 16K LDPC
By Anton Shilov Published -
PremiumHBM roadmaps for Micron, Samsung, and SK hynix: To HBM4 and beyond
By Anton Shilov Published -
PremiumInside the future of 3D NAND: The roadmap to 500 layers
By Anton Shilov Published
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News Analysis
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PremiumChina's homegrown silicon suppliers gain traction as Nvidia struggles to get its chips into the market
By Jon Martindale Published -
PremiumWhy Nvidia just poured $2 billion into AI ASIC competitor Marvell — NVLink Fusion turns into soft ecosystem lock-in
By Luke James Published -
PremiumThe global helium shortage is a direct threat to the chipmaking supply chain
By Luke James Published -
PremiumAnalyzing Elon Musk's TeraFab — A step towards Tesla and SpaceX's partial vertical integration, or an unattainable dream?
By Anton Shilov Published -
PremiumUS Senators call for a halt to Nvidia GPU exports in the wake of the Super Micro scandal
By Jon Martindale Published -
PremiumThe Super Micro AI accelerator smuggling scandal proves how cut-throat the global AI race has become — as global trade evolves, so does export control evasion
By Jon Martindale Published
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Latest
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PremiumGlass cloth could be the next great AI shortage, as major manufacturers scramble to secure critical material
By Jon Martindale Published -
PremiumAnalyzing Washington's new AI accelerator export rules
By Anton Shilov Published -
PremiumGlobalFoundries acquires ARC and RISC-V IP from Synopsys
By Anton Shilov Published -
PremiumSK hynix to spend $13 billion on the world's largest HBM memory assembly plant amid the worst shortage on record
By Anton Shilov Published -
PremiumAI chip design is pushing advanced chip packaging to its limits
By Luke James Published -
PremiumQwen boss says Chinese AI models have 'less than 20%' chance of leapfrogging Western counterparts
By Luke James Published -
PremiumDeepseek research touts memory breakthrough, decoupling compute power and RAM pools to bypass GPU constraints
By Sayem Ahmed Published -
PremiumJensen Huang discusses the economics of inference, power delivery, and more at CES 2026 press Q&A session
By Luke James Published -
PremiumIntel Panther Lake press Q&A transcript — EVO is still alive, and the company ditches prior-generation naming scheme
By Sayem Ahmed Published -
PremiumChinese researchers hail breakthrough in DRAM-like cells, which could be used in embedded or 3D stacked memory
By Anton Shilov Published -
PremiumNvidia refutes reports of HBM4 mass production delay, production 'on track' for the second half of 2025
By Luke James Published -
PremiumMicron to begin work on $100 billion New York 'megafab' imminently
By Anton Shilov Published
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