-
PremiumSamsung and SK hynix shorten memory contracts as pricing power shifts back to suppliers
-
-
PremiumU.S. government plans tariff exemptions for TSMC, if it follows through on American investment
-
Ultra Ethernet: The data-center interconnection of tomorrow detailed
-
Access Bench to view a treasure trove of data and compare products
-
Leave your feedback on Tom's Hardware Premium
-
Subscribe to Tom's Hardware Premium
- ✓ Premium-exclusive features and interviews
- ✓ Unlock expert news analysis and roadmaps
- ✓ Harness the power of our Bench database
ANNUALLY
$108.00
$69.00
MONTHLY
$9.00
$7.00
-
-
Premium
Ultra Ethernet: The data-center interconnection of tomorrow detailed
-
PremiumCPU scaling with DLSS
-
PremiumPhotonics and high-speed data movement is the next big AI bottleneck
-
PremiumThe Stout Owl: How I Built the Ultimate Noctua G2 PC
-
PremiumAMD CES 2026 gaming trends press Q&A roundtable transcript — 'we see a little bit of an uptick in the percentage of AM4 versus AM5 platforms'
-
PremiumAMD ROCm CES 2026 press Q&A roundtable transcript — 'ROCm from 2023 is completely unrecognizable to ROCm today' company details, as it seeks to break down barriers to AI development
-
-
-
PremiumHuawei Ascend NPU roadmap examined — company targets 4 ZettaFLOPS FP4 performance by 2028, amid manufacturing constraints
-
PremiumInside the AI accelerator arms race: AMD, Nvidia, and hyperscalers commit to annual releases through the decade
-
PremiumThe future of DRAM: From DDR5 advancements to future ICs
-
PremiumDesktop GPU roadmap: Nvidia Rubin, AMD UDNA & Intel Xe3 Celestial
-
News AnalysisSilicon Motion announces new devices: PCIe 6.0 SSDs, 256 / 512 TB drives, and next-gen 16K LDPC
-
PremiumHBM roadmaps for Micron, Samsung, and SK hynix: To HBM4 and beyond
-
PremiumInside the future of 3D NAND: The roadmap to 500 layers
-
PremiumNvidia enterprise GPU and CPU roadmaps: Rubin, Rubin Ultra, Feynman, and silicon photonics
-
News AnalysisMicron details new U.S. fab projects — HBM production coming to America
-
TSMC to spend $42 billion on expansion in 2025 — ambitious plans detail nine production facilities
-
-
-
Premium
U.S. government plans tariff exemptions for TSMC, if it follows through on American investment
-
PremiumSamsung and SK hynix shorten memory contracts as pricing power shifts back to suppliers
-
PremiumMemory makers are set to earn $551 billion from the AI boom, twice as much as contract chip manufacturers
-
PremiumAlphabet is doubling its capital expenditure to a staggering $180 billion in 2026
-
PremiumClaimed 1,100% increase in AI-driven layoffs in 2025 might be misleading
-
PremiumAmazon's European data centers challenged by grid delays
-
-
-
Premium
Micron to begin work on $100 billion New York 'megafab' imminently
-
PremiumNvidia CEO Jensen Huang explains why SRAM isn't here to eat HBM's lunch
-
PremiumNvidia's focus on rack-scale AI systems is a portent for the year to come
-
PremiumChina’s GPU cloud consolidates around Baidu and Huawei as domestic AI chips scale up
-
PremiumChina’s top chip foundries move to consolidate as Beijing pushes semiconductor self-sufficiency
-
PremiumChip scarcity assaults auto industry amid the worsening Nexperia and DRAM crisis
-
PremiumU.S. electricity grid stretches thin as data centers rush to turn on onsite generators
-
PremiumMicron secures $318 million Taiwanese subsidy for HBM R&D as AI memory arms race intensifies
-
PremiumA deeper look at the tightened chipmaking supply chain, and where it may be headed in 2026
-
Huawei’s Ascend and Kunpeng progress shows how China is rebuilding an AI compute stack under sanctions
-
PremiumNvidia's CUDA Tile examined: AI giant releases programming style for Rubin, Feynman, and beyond
-
SK hynix to build first U.S. packaging plant for HBM
-
