Latest about Manufacturing
Intel reportedly in talks with Google and Amazon over advanced packaging
Intel is understood to be in active talks with Google and Amazon to provide advanced chip packaging services for their custom AI ASICs.
U.S. lawmakers aim to ban export of DUV chipmaking and etching tools to leading firms in China
Chinese chipmakers will lose ability to buy advanced tools for trailing node fabs, if new proposes becomes the law.
TSMC reportedly plans to build 12 fabs, four packaging facilities in Arizona
New rumor indicates that TSMC is looking forward to expand its presence in the U.S. to 12 fabs and four packaging facilities.
Intel buys back 49% stake in Ireland Fab Joint Venture — takes full control over Fab 34
In a mutually beneficial deal, Intel repurchases 49% of Fab 34 from Apollo for $14.2 billion, reducing pressure on its margins, but paying a hefty $3 billion premium to the financial company.
The global helium shortage is a direct threat to the chipmaking supply chain
Premium Some industry analysts expect it will take Qatar around five years to regain lost capacity.
TSMC industrial espionage saga heading to verdict next month in unprecedented Taiwan National Security Act case
One of the three landmark cases involving the theft of trade secrets from TSMC has run through investigative and court proceedings, and a verdict is scheduled for April 27.
Analyzing Elon Musk's TeraFab — A step towards Tesla and SpaceX's partial vertical integration, or an unattainable dream?
Premium Raising trillions of dollars and building 150+ fabs in a few years?
Chinese chip industry leaders admit the country lags five to ten years behind in AI data center chips
Senior Chinese semiconductor executives said AI-driven demand is creating bottlenecks across equipment, passive components, and workforce capacity.
