Nvidia Exploring Various Multi-Chip GPU Designs

Nvidia researchers have published an article detailing the various ways the company is exploring how Multi Chip Module (MCM) designs can be deployed for future products. As computing becomes more and more heterogeneous, Nvidia seems to be looking for a way to add flexibility to its semiconductor designs. This could be achieved by "mix and matching" different hardware blocks according to the intended workloads, and that's exactly where MCM comes in.

The first factual information on AMD's research into MCM came to light in 2017, when the company demonstrated how an MCM design with four chiplets could outperform the biggest monolithic GPU that could be built at the time by a whopping 45.5%. Cutting up a large die into several smaller ones helps improve yields (smaller dies have fewer chances of having critical manufacturing defects), and also allows for more computing resources to be chained together than a single, monolithic die ever could. Of course, being smaller, these chips should also present better thermals and power efficiency than their larger brethren.

Nvidia's doubling-down on MCM GPUs is called the Composable On Package GPU, or COPA. This latest research piece is more concerned with how Nvidia will handle the increasing differentiation between HPC and AI workloads, which have been drifting apart for a while now. Clearly, Nvidia is concerned that its single-product approach (read: the GA100 accelerator and its predecessors) will start losing ground towards the increasing workload specialization in those areas.

Diagrams on Nvidia COPA MCM

A diagram comparing a monolithic GPU, which crams all the execution units and caches for a true general purpose GPU. COPA allows for the mix and match of different hardware blocks, building upon certain workload requirements in detriment of others, and a higher number of more specialized (and more performant) chip designs. (Image credit: Nvidia)
Francisco Pires
Freelance News Writer

Francisco Pires is a freelance news writer for Tom's Hardware with a soft side for quantum computing.

  • VforV
    Yeah, they need to "explore" harder because AMD already shipped their server MCM GPUs and soon™, later this year Radeon will have RDNA3 gaming GPUs with MCM and still nvidia will be on monolithic design. Good times.
    Reply
  • spongiemaster
    Welcome to 2019.

    https://www.pcgamesn.com/nvidia/graphics-card-chiplet-designs
    “This gives us a bunch of technologies on the shelf that at some point in time,” says Dally, “if it became economically the right thing to do to, assemble GPUs from multiple chiplets, we basically have de-risked the technology. Now it’s a tool in the toolbox for a GPU designer.” "
    Reply
  • Endymio
    "Of course, being smaller, these chips should also present better thermals and power efficiency than their larger brethren... "

    Article quality has degraded markedly as of late. Die size does not affect power efficiency. Nor does it improve thermals, if those smaller chiplets are combined into an equivalent-sized package. NVidia's COPA is about flexibility and yields, nothing more.
    Reply
  • renz496
    there are interesting read at next plaform. it seems going forward nvidia might end up making two type of compute card. one for HPC and one for AI. then nvidia will optimize the design based on it's need (HPC or AI) . although the next platform said the industry want one chip solution that is exceptional at both HPC and AI task.
    Reply