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Sales of chip production equipment to reach $156 billion by 2027 due to AI and DRAM demand
By Anton Shilov published
Driven by demand for AI and HPC accelerators, sales of chip production equipment are projected to increase through 2027. Asian countries are expected to lead the pack, according to SEMI.

Rapidus explores panel-level packaging on glass substrates for next-generation processors
By Anton Shilov published
Wedding glass and PLP ahead of others?

Intel details progress on fabbing 2D transistors a few atoms thick in standard high volume fab production environment
By Anton Shilov published
2D materials are getting closer to manufacturability using industry-standard equipment.

Intel installs industry's first commercial High-NA EUV lithography tool
By Anton Shilov published
Sets the stage for 14A process technology.

New 1.4nm nanoimprint lithography template could reduce the need for EUV steps in advanced process nodes
By Luke James published
Premium Japan’s Dai Nippon Printing (DNP) claims to have developed a nanoimprint lithography template capable of patterning logic with a feature size of 1.4nm, with plans for mass production in 2027.

Qualcomm’s Ventana acquisition points to a long-term RISC-V strategy to complement its Arm lineup
By Luke James published
The chipmaker is bringing high-performance RISC-V CPU expertise in-house as it balances Arm, Oryon, and future AI-era compute demands.

First truly 3D chip fabbed at US foundry, features carbon nanotube transistors and RAM on a single die
By Luke James published
A collaborative research team has demonstrated what it says is the first monolithic 3D integrated circuit manufactured at a commercial U.S. foundry.

Nvidia weighs expanding H200 production as new China orders rush in, report claims
By Luke James published
Nvidia is evaluating whether to increase production of its H200 data center GPUs after demand from Chinese customers is expected to exceed current supply.
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