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China's top chip execs claim ASML alternative 'small, fragmented, and weak'
China's most senior semiconductor executives issued a public call this week for a consolidated national effort to build a domestic alternative to Dutch lithography giant ASML.
Intel CEO recognizes its 18A node for external customers as 18A-P gets 'inbound interest'
Intel sees 'inbound interest' for 18A-P process technology despite 18A process variability.
ISSCC 2026: Rebellions details industry's first quad-chiplet AI solution with UCIe interconnects
Premium A sign of things to come.
ISSCC 2026: AMD discloses how the Instinct MI355X doubled per-CU throughput despite lower compute unit count
Premium Taking to the stage at ISSCC, AMD’s Ramasamy Adaikkalavan talked through how AMD managed to fit nearly double the compute throughput into the same die area as its predecessor,
Rapidus secures $1.7 billion from Japan’s government and private investors for 2nm chip production
Under the arrangement, the government will initially hold roughly 10% of Rapidus's voting shares and the majority of its stake in non-voting stock.
Imec's new post-exposure bake method speeds up EUV chipmaking tools, boosting production for the most advanced chips
Increased oxygen concentration during the EUV lithography post-exposure bake step can increase photoresist performance by 15% - 20%, according to Imec's findings.
Chipmakers still suffering from rare earth shortages, says report
Some suppliers have even rejected taking on new clients because of limited inventories.
