Efficiency Analysis: Core i3 Trumps Atom On The Desktop

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Atom was designed to be a low-cost, low-power solution, but its value in the desktop space is debatable if you consider performance. We pit the cheapest Core i3 against Intel's Atom on a performance-per-dollar and a per-watt basis to see which is better.

Processor Comparison Table

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Processor Comparison Table
Name Intel Core i3-530 Intel Atom D510 Intel Atom 230
Code Name Clarkdale Pineview Diamondville
Launch Date Q1'10 Q1'10 Q2'08
Processor Number i3-530 D510 230
# of Cores 2 2 1
# of Threads 4 4 2
Clock Speed 2.93 GHz 1.66 GHz 1.6 GHz
Cache 4 MB Smart Cache 1 MB L2 Cache 512 KB L2 Cache
Bus/Core Ratio 22 Row 8 - Cell 2 12
Bus Type DMI DMI FSB
System Bus 2.5 GT/s Row 10 - Cell 2 533 MHz
FSB Parity Row 11 - Cell 1 Row 11 - Cell 2 No
Instruction Set 64-bit 64-bit 64-bit
Instruction Set Extensions SSE4.2 SSE2, SSE3, SSSE3 Row 13 - Cell 3
Embedded No Yes No
Supplemental SKU No No No
Lithography 32 nm 45 nm 45 nm
Max TDP 73W 13W 4W
VID Voltage Range 0.6500V-1.400V 0.800V-1.175V 0.9V-1.1625V
1ku Bulk Budgetary Price (4/10) $113.00 $63.00 $29.00
Max Memory Size (dependent on memory type) 16GB 4GB n/a
Memory Types DDR3-1066/1333 DDR2-667/800 n/a
# of Memory Channels 2 1 n/a
Max Memory Bandwidth 21 GB/s 6.4 GB/s n/a
Physical Address Extensions 36-bit 32-bit n/a
ECC Memory Supported Row 25 - Cell 1 No n/a
Graphics Specification
Integrated Graphics Yes Yes n/a
Intel® HD Graphics Yes No n/a
Graphics Base Frequency 733 MHz 400 MHz n/a
Intel® Flexible Display Interface (Intel® FDI) Yes n/a n/a
Intel® Clear Video HD Technology Yes n/a n/a
Dual Display Capable Yes Yes n/a
Expansion Options
PCI Express Revision 2 n/a n/a
PCI Express Configurations 1x16, 2x8 n/a n/a
# of PCI Express Ports 1 n/a n/a
Package Specifications
Max CPU Configuration 1 1 1
Tcase 72.6°C Row 39 - Cell 2 85.2°C
Tjunction Row 40 - Cell 1 100°C Row 40 - Cell 3
Package Size 37.5 mm x 37.5 mm 22 mm x 22 mm 22 mm x 22 mm
Lithography 32 nm 45 nm 45 nm
Processing Die Size 81 mm2 87 mm2 26 mm2
# of Processing Die Transistors 382 million 176 million 47 million
Graphics and IMC Lithography 45 nm n/a n/a
Graphics and IMC Die Size 114 mm2 n/a n/a
# of Graphics and IMC Die Transistors 177 million n/a n/a
Sockets Supported FCLGA1156 FCBGA559 PBGA437
Halogen Free Options Available Yes Yes Yes
Advanced Technologies
Intel® Turbo Boost Technology No No No
Intel® Hyper-Threading Technology Yes Yes Yes
Intel® Virtualization Technology (VT-x) Yes No No
Intel® Virtualization Technology for Directed I/O (VT-d) No No No
Intel® Trusted Execution Technology No No No
AES New Instructions No No Row 56 - Cell 3
Intel® 64 Yes Yes Yes
Idle States Yes No No
Enhanced Intel® Speedstep Technology Yes No No
Intel® Demand Based Switching No No No
Thermal Monitoring Technologies No No No
Execute Disable Bit Yes Yes Yes

Source: Intel ark (ark.intel.com)