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By Shane Downing Published
Premium Nanya-backed DRAM designer PieceMakers began trading in Taipei on Sept. 16 on a bet that AI inference memory won’t be HBM.

By Anton Shilov Published
Nvidia CEO thinks that in light of his view of a three- to four-year timeline for Chinese development of advanced semi tooling, the country is "already there."

By Jowi Morales Published
This could potentially be the first HBM manufacturing plant in the U.S.

By Etiido Uko Published
Micron is offering Taiwan employees a NT$1 million cash bonus, but unions have rejected the package and are demanding permanent profit sharing as strike talks continue.

By Anton Shilov Published
Pacific Quartz gets its high-purity quartz qualified for semiconductor equipment and DRAM manufacturing.

By Etiido Uko Published
Premium Anjinomoto's secret sauce.

By Anton Shilov Published
Premium ASML, Intel, Samsung, and TSMC back development of 6×12-inch to build large processors using High-NA EUV lithography systems without stitching.

By Anton Shilov Published
TSMC discloses plans to use High-NA EUV lithography in 2030, 6×12-inch photomasks with new scanners in 2033.

By Etiido Uko Published
Linked Chinese company was established months after the suspect joined BelGaN

By Anton Shilov Published
Intel is leading the semiconductor industry with High-NA fleet and process-maturity milestone as it reaches 1 million wafers processed using High-NA tools, moves forward with 6×12 photomask effort.
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