TSMC introduces 65nm embedded DRAM

Taiwan Semiconductor Manufacturing Company (TSMC) today announced a functional 65nm embedded DRAM customer product which contains millions of DRAM bits and was silicon verified first time right. This 65nm embedded DRAM process and IP provide a higher bandwidth, lower power consumption, and a close to 50% smaller cell and macro size than previous high density memory generations, according to TSMC.

More here at DigiTimes.

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