G.Skill Announces Bleeding Edge DDR5-8200 48GB Kit

G.Skill Trident Z5 8200MT/s
(Image credit: G.Skill)

G.Skill has announced five new Trident Z5 DDR5 memory kits for Intel platforms, featuring the all-new 24GB and 48GB capacity DDR5 modules and memory speeds of up to 8200MT/s. The 8200MT/s kit, in particular, will be among the fastest on the market, and it will come with more than 32GB of capacity.

To reiterate, only one DDR5-8200 kit is rated for that speed in the list. This will be a 24GB x 2 (48GB) DDR5 memory kit with 40-52-52 timings. For perspective, this kit has slightly quicker memory latency than a DDR5 5600MHz CL28 or 6000MHz CL30 kit. So it will be great for memory-sensitive applications, like gaming, and vastly superior for bandwidth-heavy workloads.

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Aaron Klotz
Contributing Writer

Aaron Klotz is a contributing writer for Tom’s Hardware, covering news related to computer hardware such as CPUs, and graphics cards.

  • hotaru251
    ahh yes. more ram with speeds 90% of MB's can't run at.
    Reply
  • phazeshifta
    This isn't a kit meant to run on that 90% of boards though. This is meant for the best computers, not your mom's web browsing box.

    If you want to get RAM for that 90% of boards, you have plenty of other options...and that's just fine.
    Reply
  • SyCoREAPER
    What's with DDR5 using these odd kits of 24 and 48GB? I've been seeing this with various kits. Are traditional 8, 16, 32, 64 dead in favor of 24, 48, 96 (perspectively)?
    Reply
  • thisisaname
    phazeshifta said:
    This isn't a kit meant to run on that 90% of boards though. This is meant for the best computers, not your mom's web browsing box.

    If you want to get RAM for that 90% of boards, you have plenty of other options...and that's just fine.

    Going from Asus's web site the ASUS ROG Maximus Z790 Hero does not support 8400MT/s either.
    https://rog.asus.com/motherboards/rog-maximus/rog-maximus-z790-hero-model/spec/
    4 x DIMM, Max. 192GB, DDR5 7800+(OC)/7600(OC)/7400(OC)/7200(OC)/7000(OC)/6800(OC)/6600(OC)/6400(OC)/ 6200(OC)/ 6000(OC)/ 5800(OC)/ 5600/ 5400/ 5200/ 5000/ 4800MHz Non-ECC, Un-buffered Memory*
    Reply
  • bit_user
    sycoreaper said:
    What's with DDR5 using these odd kits of 24 and 48GB? I've been seeing this with various kits.
    It's just that the DDR5 standard added support for these half-steps. Maybe it was done out of concern that DRAM density improvements are starting to plateau?

    sycoreaper said:
    Are traditional 8, 16, 32, 64 dead in favor of 24, 48, 96 (perspectively)?
    I don't know why these high-speed kits are using those sizes, but for those limited to single-rank then 24 GB DIMMs are more attractive than the alternative of 16 GB DIMMs. Given the top $ these will cost, I guess that's meant to be an added benefit. Or, maybe it's just that the half-step die sizes are the latest generation, and therefore best-clocking?
    Reply
  • SyCoREAPER
    bit_user said:
    It's just that the DDR5 standard added support for these half-steps. Maybe it was done out of concern that DRAM density improvements are starting to plateau?


    I don't know why these high-speed kits are using those sizes, but for those limited to single-rank then 24 GB DIMMs are more attractive than the alternative of 16 GB DIMMs. Given the top $ these will cost, I guess that's meant to be an added benefit. Or, maybe it's just that the half-step die sizes are the latest generation, and therefore best-clocking?
    Fianlly, someone answered, thanks. I was surprised to see that more weren't curious about it. Best info so far, thank you.
    Reply
  • bit_user
    sycoreaper said:
    Fianlly, someone answered, thanks. I was surprised to see that more weren't curious about it. Best info so far, thank you.
    Here is a graphic that illustrates the plateau in DRAM density that I mentioned.
    Source: https://www.tomshardware.com/news/3d-x-dram-roadmap-1tb-die-density-by-2030
    The "extension" part is using a new 3D X-DRAM technology just announced by a company called Neo Semiconductor.
    Reply
  • kerberos_20
    bit_user said:
    The "extension" part is using a new 3D X-DRAM technology just announced by a company called Neo Semiconductor.
    which still can take nosedive if nobody will use it, announced doesnt mean it will be available for consumers, there are many memory technologies announced superior to ddr and yet we are still on ddr several years later

    3d stacked ram has been in work for few years already, hbm pretty much kills competition, but ye if something better pops up, why not if it wont cost you leg and kidney
    Reply
  • bit_user
    kerberos_20 said:
    which still can take nosedive if nobody will use it, announced doesnt mean it will be available for consumers, there are many memory technologies announced superior to ddr and yet we are still on ddr several years later
    Hopefully, NEO won't be as greedy as Rambus. It would be especially nice if someone found an alternate way to do 3D DRAM, and then NEO had to license its tech on the cheap, rather than at a price that makes it virtually uninteresting to DRAM makers.
    Reply