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Huawei’s Ascend and Kunpeng progress shows how China is rebuilding an AI compute stack under sanctions
By Luke James published
Atlas 900 and Ascend supernodes highlight a scaling-first approach as Huawei trades per-chip efficiency for system-level throughput.

UK company shoots a 1000-degree furnace into space to study off-world chip manufacturing
By Jowi Morales published
One small step for chips, one giant leap for a lack of impurities.

China warns the Netherlands to ‘immediately correct its mistakes’ over Nexperia saga that has disrupted auto production
By Jowi Morales published
Beijing says that the Netherlands is not taking steps to resolve the Nexperia issue, thus extending the chip shortage affecting automotive makers across the globe.

China tells chipmakers to use homegrown chipmaking tools for 50% of new capacity
By Anton Shilov published
But there is a catch, or two.

TSMC begins quietly volume production of 2nm-class chips
By Anton Shilov published
As planned.

TSMC's average wafer prices increased by over 15% each year since 2019, report suggests
By Anton Shilov published
Premium TSMC hits a home run in the EUV era.

Nvidia's $20 billion Groq IP deal bolsters AI market domination
By Luke James published
Premium Nvidia has announced a $20 billion deal to acquire Groq’s intellectual property, though not the company itself, and absorb key members of its engineering team.

TSMC factories rocked by magnitude 7.0 earthquake that was the strongest in 27 years, but facilities escaped unharmed
By Bruno Ferreira published
Quake didn't result in quad damage this time.

Nexperia China seeks new wafer suppliers amid legal standoff with Dutch parent, could take 6 months for qualification
By Luke James published
Nexperia’s China unit is moving to line up new wafer suppliers over the next six to nine months amid a deepening legal and operational dispute with its Dutch parent company.

Intel displays tech to build extreme multi-chiplet packages 12 times the size of the largest AI processors, beating TSMC's biggest
By Anton Shilov published
Intel Foundry has released a video of a multi-chiplet 2.5D/3D processor with a 10,296 mm^2 silicon footprint, including leading-edge technologies such as 14A and 18A.
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