Latest about Manufacturing
Intel 18A wafer-to-wafer yield issues fixed, report claims
Intel reportedly solves one of the key issues that plagued its 18A process technology, but others may still be there.
Intel expands production of photomasks in California: EUV and High-NA EUV in the focal point
Intel begins expansion of its Bowers Campus in Santa Clara to produce more photomasks in-house, which is set to be crucial as process technologies get more sophisticated.
Tesla hires 17-year Intel veteran responsible for billion-dollar fab startups — Gary Jiang likely chosen to oversee fab efforts for Terafab's licensing of 14A
Tesla hires an Intel veteran, who most recently was responsible for installing advanced tools at Intel's Arizona fab that is now ramping production of chips using 18A fabrication process.
South Korea unveils $520 billion investment plan with Samsung and SK Hynix to expand memory chip dominance
President Lee unveiled an 800 trillion won ($520B) public-private plan for four new Samsung and SK Hynix fabs, dwarfing the US CHIPS Act tenfold.
Imec's 2026 roadmap details 0.3nm nodes by 2038, CFET transistors become viable at 0.7nm
Premium As CPP shrinking stalls, chipmakers find a new way to increase transistor density. Imec foresees 0.3nm in 2038, CFET insertion in 2038, HLSI era.
IBM goes sub-1nm, develops 0.7nm-class technology
IBM's new 0.7nm-class fabrication process uses nanostack transistors, requires 2x more FEOL steps for massive improvements in performance, power, and area.
TSMC is reportedly hiking prices for 'all advanced nodes,' accounting for 74% of the company’s wafer business
TSMC has reportedly told customers to prepare for 5% to 10% price hikes across advanced chip nodes, extending beyond 3nm to include 7nm and some legacy processes.
Rare ASML Special Edition Monopoly board unearthed in social media trade
We just witnessed a significant semiconductor industry related non-cash trade deal take place on Twitter/X.
