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HPE adopts AMD’s Helios rack architecture for 2026 AI systems — new rack form factor gets its first major partner ahead of 2026 availability
By Luke James published
AMD and HPE are expanding their long-running partnership with a new agreement that will bring the AMD Helios rack-scale AI architecture into HPE’s product portfolio from 2026.

U.S government awards Gelsinger-backed EUV developer xLight with $150 million in federal incentives
By Anton Shilov published
U.S. government to inject up to $150 million in xLight, a startup developing EUV light source based on a particle accelerator, with the first CHIPS and Science Act grant by the Trump Administration.

Samsung touts 96% lower-power NAND design
By Luke James published
Samsung researchers have published a detailed account of an experimental NAND architecture that aims to cut one of the technology’s largest power drains by as much as 96%.

Industry's first TSMC COUPE-based optical connectivity solution for next-gen AI chips displayed — Alchip and Ayar Labs show future silicon photonics device
By Anton Shilov published
Alchip and Ayar Labs team up to build optical connectivity solution based on TSMC's COUPE framework that lets fabless chip designers to easily add optical connectivity to their designs.

NAND wafer shortages push November contract prices up by over 60% — market tightens as hyperscalers purchase capacity for AI data centers
By Luke James published
TrendForce reported on December 1 that NAND Flash wafer supply tightened sharply in November as AI workloads and enterprise SSD orders continued to drive sustained demand.

$1.5 trillion lithium deposit found in U.S. supervolcano crater
By Mark Tyson published
Scientists reckon that the McDermitt Caldera in the US might hold the largest deposit of lithium ever found.

Intel moves closer to building Apple’s entry-level M-series chips on 18A from 2027
By Luke James published
Apple is preparing to qualify Intel’s 18A process for its lowest-end M-series processor, according to a post on X from analyst Ming-Chi Kuo.

Micron plans $9.6 billion HBM fab in Japan as AI memory race accelerates
By Luke James published
Micron is preparing a major expansion of its Hiroshima operations to build a dedicated high-bandwidth memory facility, according to a report by Nikkei Asia.
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