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Built-in 3/3.5G may be next big thing in notebook market

By - Source: Tom's Hardware US | B 0 comment

Communications chip suppliers are eying the huge business opportunities promised by notebooks with built-in 3/3.5G modules.

Qualcomm has teamed up with Hewlett Packard (HP), Dell and Lenovo to launch notebooks that support CDMA 2000 1x EV-DO or High-Speed Packet Access (HSPA), while Ericsson Mobile Platforms (EMP) is also looking for partners in Taiwan's notebook sector to work on built-in 3.5G HSPA, industry observers have indicated.

More here at DigiTimes.

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