News-analysis archive

December 2025

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26 articles

December 31
- Huawei’s Ascend and Kunpeng progress shows how China is rebuilding an AI compute stack under sanctions
December 30
- SK hynix to build first U.S. packaging plant for HBM — plugs critical hole in U.S. supply chain, $3.9B investment challenges TSMC and reshapes AI supply chains
- SoftBank stakes $4B on securing AI data center power and capacity — DigitalBridge purchase indicative of AI industry's increasing investments in energy supply
December 29
- Nvidia's $20 billion Groq IP deal bolsters AI market domination — hardware stack and key engineer behind Google TPUs included in bombshell agreement
December 26
- Nvidia reportedly backs away from its effort to make its own public cloud, team reorg eases friction with customers — chipmaker shifts unit's focus to internal R&D
- How China’s control of battery supply chains is becoming a critical risk for U.S. military power and AI initiatives — reducing reliance will take nearly a decade
December 25
- China chipmaker SMIC raises wafer prices by about 10% as memory demand tightens capacity
December 24
- SK hynix expands U.S. presence with new Bellevue, Seattle office in efforts to get closer to its largest customers — offices near Nvidia, Amazon, and Microsoft highlight co-designed HBM efforts
- China's reverse-engineered Frankenstein EUV chipmaking tool hasn't produced a single chip — sanctions-busting experiment is still years away from becoming operational
December 23
- Former Chinese gaming company with China govt ties accused of smuggling banned AI GPUs — Nvidia’s biggest Southeast Asia customer exposes the limits of U.S. AI export controls (Updated)
- Nvidia prepares shipment of 82,000 AI GPUs to China as chip war lines blur — H200 shipments with 25% tax to begin as US loosens restrictions
December 22
- Chinese fabs are reportedly upgrading older ASML DUV lithography chipmaking machines — secondary channels and independent engineers used to soup up Twinscan NXT series
December 19
- Samsung introduces SOCAMM2 LPDDR5X memory module for AI data centers — new standard set to offer reduced power consumption and double the bandwidth versus DDR5 RDIMMs
December 18
- Huawei's AI chip capabilities still pale in comparison to American silicon — report from U.S. council details that despite fears, Nvidia continues to lead by a wide margin
December 17
- Kioxia's next-gen 3D NAND production gets expedited to 2026, report claims — high-capacity 332-layer BiCS10 devices to sate growing demand from AI data centers
December 16
- New 1.4nm nanoimprint lithography template could reduce the need for EUV steps in advanced process nodes — questions linger as no foundry has yet committed to nanoimprint lithography for high-volume manufacturing
- Qualcomm’s Ventana acquisition points to a long-term RISC-V strategy to complement its Arm lineup
December 12
- Cambricon targets 500,000 AI chips in 2026 as China accelerates domestic hardware push — low yields and limited HBM supply could threaten chip ambitions
December 11
- Microsoft, Google, OpenAI, and Anthropic join forces to form Agentic AI alliance, according to report — organization backed by the Linux Foundation is set to create open source standards for AI agents
December 10
- The Nvidia H200 export saga, as it happened — Beijing ponders response and buyers line up, while Blackwell remains locked behind restrictions
December 9
- Marvell’s $5.5B Celestial AI acquisition expands its role in AI data center hardware — firm now positioned to deliver next-gen optical interconnects
December 8
- The Senate's new SAFE bill is set to curb access to advanced chips to China, but that won't slow down the AI war — training workloads still heavily rely on Nvidia, while alternatives remain inefficient
December 4
- Nexperia’s standoff puts a core part of the chip supply chain under strain — U.S export controls and red tape may threaten consumer continuity without governance
December 3
- Nvidia’s $2B Synopsys stake strengthens its push into AI-accelerated chip design — partnership to bolster GPU-accelerated EDA tools, but a careful balance is required
December 2
- HBM undergoes major architectural shakeup as TSMC and GUC detail HBM4, HBM4E and C-HBM4E — 3nm base dies to enable 2.5x performance boost with speeds of up to 12.8GT/s by 2027
December 1
- Nvidia’s TiDAR experiment could speed up AI token generation using hybrid diffusion decoder — new research boasts big throughput gains, but limitations remain