One of the key ingredients of Intel's IDM 2.0 strategy is to build numerous new fabs that will provide enough manufacturing capacity for Intel and its contractors. Typically, semiconductor facilities are built with support from governments and local authorities, so IDM 2.0 encompasses Intel's collaboration with various administrations. According to Reuters, next week Pat Gelsinger, CEO of Intel, will travel to Europe to discuss building a new fab in the EU.
Gelsinger is expected to meet with European Union officials to discuss building a new semiconductor production facility as well as Europe-based customers, says a Reuters report that cites a statement by Intel. Intel did not say where it plans to locate its new fab. It is also unclear whether the head of Intel will meet with the company's existing customers, or potential clients that may outsource production of chips to Intel Foundry Services.
Intel already has a fab in the European Union near Leixlip, Ireland. The site is currently being upgraded and will produce chips using the company's 7nm technology after the works are complete.
To build a manufacturing facility in Europe, companies need multiple permissions from the local administrations, so Intel will have to work on multiple levels — the EU, national governments, local authorities — to build its new fab in the European Union. Apparently, the head of the company will start negotiations with the EU officials next week and from there the chip giant will go to other levels.
